Engineering and Technology: Bioengineering, Engineering and Technology: Electronics, Engineering and Technology: Engineering
The Cornell NanoScale Science & Technology Facility Research Experience for Undergraduates (CNF REU) Program is designed to give undergraduate students an introductory research experience in nanotechnology. Each year, we will hire students who will be hosted by a Cornell faculty member. Each student will work on an independent research project using the advanced resources available at CNF and Cornell. Potential projects span a large range of nanotechnology, from electronic materials to biomedical engineering.
The CNF REU Program runs from approximately the first week of June - the first week of August, plus the NNCI REU Convocation being hosted by a different NNCI site each year the second week of August. Finally, each CNF REU intern writes a two-page report that is published as part of the CNF Research Accomplishments. Altogether, the program offers an excellent ten-week introduction to nanotechnology and a preview of a scientific research career. CNF REU interns receive a $5,000 stipend, on-campus housing, and all reasonable travel expenses are paid for directly or reimbursed. And of course, the CNF covers all reasonable research expenses!
About Cornell NanoScale Science & Technology Facility (CNF)
The Cornell NanoScale Science & Technology Facility (CNF) is a national user facility that supports a broad range of nanoscale science and technology projects by providing state-of-the-art resources coupled with expert staff support. CNF has been serving the science and engineering community since 1977 -- 2017 marks our 40th anniversary! Research at CNF encompasses physical sciences, engineering, and life sciences, and has a strong inter-disciplinary emphasis. Over 800 users per year (50% of whom come from outside Cornell) use the fabrication, synthesis, computation, characterization, and integration resources of CNF to build structures, devices, and systems from atomic to complex length-scales.
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